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Base Material
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FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,Teflon,PI ,etc
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Layers
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1-40 ( ≥30 layers needs review )
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Finished inner/outer copper thickness
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0.5-6OZ
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Finished board thickness
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0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL
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Board thickness≤1.0mm: +/-0.1mm
1Board thickness>2.0mm: +/-8%
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Max panel size
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≤2sidesPCB: 600*1500mm
Multilayer PCB: 500*1200mm
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Min conductor line width/spacing
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Inner layers: ≥3/3mil
Outer layers: ≥3.5/3.5mil
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Min hole size
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Mechanical hole: 0.15mm
Laser hole: 0.1mm
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Drilling precision: first drilling First drilling: 1mil
Second drilling: 4mil
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Warpage
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Board thickness≤0.79mm: β≤1.0%
0.80≤Board thickness≤2.4mm: β≤0.7%
Board thickness≥2.5mm: β≤0.5%
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Controlled Impedance
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+/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review)
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Aspect Ratio
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15:01
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Min welding ring
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4mil
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Min solder mask bridge
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≥0.08mm
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Plugging vias capability
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0.2-0.8mm
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Hole tolerance
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PTH: +/-3mil
NPTH: +/-2mil
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Outline profile
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Rout/ V-cut/ Bridge/ Stamp hole
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Solder mask color
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Green,yellow,black,blue,red,white,matte green
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Component mark color
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white,yellow,black
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Surface treatment
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OSP: 0.2-0.5um
HASL: 2-40um
Lead free HASL: 2-40um
ENIG: Au 1-10U’’
ENEPIG: PB 2-5U’’/ Au 1-8U’’
Immersion Tin:0.8-1.5um
Immersion silver: 0.1-1.2um
Peelable blue mask
Carbon ink
Gold plating: Au 1-150U’’
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E-Test
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Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch
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Min spacing from test pad to board edge : 0.5 mm
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Min conductive resistance : 5 Ω
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Max insulation resistance : 250 MΩ
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Max test voltage : 500 V
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Min test pad diameter : 6 mil
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Min test pad to pad spacing : 10 mil
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Max test current : 200 MA
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AOI
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Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch
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Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch
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